Is there a document describing how to write the dfi file to the Bq27531 flash?
There seems to be a document "Going to production with the bq2754x" and another "Going to production with the bq275xx" (which is newer).
The documents seem to talk about a number of commands that aren't mentioned in the TRM and which seem to collide (0x0F00 is in the range "greater that 0x0082" for the UNSEAL key). Maybe it means 0x000F?
There is also mention of a different I2C address (0x16 instead of 0xaa) can this be true?; the description of the commands isn't in the same form as the TRM and there's no clarification of the ROM Mode I2C operation in any of the documents I've found: in some places there is talk of a "register" in others "command" neither of which are I2C protocol terms - I suppose TI mean "the first 8 bits after the device address" for both "register" and "command"? But what about the order of bytes for 16 bit values (like the row address)? High byte first?
It's difficult to understand why the TRM would have so many gaps and errors. Are people actually taking these chips to production with so little formal documentation from the manufacturer? I'm having to flag the choice of Texas Instruments as a risk factor on this project.