Part Number: LM5175
Hi Team,
How to choose LM5175 buck-boost MOSFET,E.g Vin:9~36V Vo:12V/10A
How to choose MOSFET QH1 QL1 Vds 60V or 40V or other ???
How about choose Vds at QH2 QL2??
Part Number: LM5175
Hi Team,
How to choose LM5175 buck-boost MOSFET,E.g Vin:9~36V Vo:12V/10A
How to choose MOSFET QH1 QL1 Vds 60V or 40V or other ???
How about choose Vds at QH2 QL2??
Part Number: LM3481
Hello There,
We've made board as per TI's WEBENCH, We've tested the circuit with bench power supply and li-ion battery(1S) as well which we will use in final application. as webench design shows output current is 4.2and 9A but our results are far more then worst.
on the bench supply test,
Input Voltage : 3.6V
Input Current : 6.5A
Output Voltage : 3.9V
Output Current : 5.0A
During testing we've observed that Input Capacitor(15uF) gets very HOT. we tried changing with diffrent value but still same result also if we try to increase output current greater then 6.5A then output voltage becomes as Input voltage means switcher is off. also switcher does not function if we remove Input Capacitor
also with 1S Li-Ion Battery as input power source,
Input Voltage: 4.0V
Input Current : ---
Output Voltage : 4.1V
Output Current : 3.0A
same result as Bench power supply if we go over 3.0A switcher stops working(shutdown).
Please let me know if you guys have any suggestion to achive output result near to the simulation shows. I've attached schemetic and simulation from WEBENCH.
(Please visit the site to view this file)
Part Number: BQ27741EVM
Hello,
I'm using the BQ27741 Eval board and I am using the EV2400 and Battery management studio version 1.3.86.
I did some playing and programming and wasn’t able to get it to take charge current yet. I want to put back the Default software. I found the default SENC file on the TI website. The BqStudio PROGRAMMING tab only allows for the SREC file to be programmed. How do I program the default SENC back into the chip.
Thanks for the help!
Best,
Adam
Part Number: TPS55340
Dear all,
We are currently looking for a replacement for the LT3436.
https://www.analog.com/media/en/technical-documentation/data-sheets/3436fa.pdf
However, our customers use this device to generate an input voltage of -15V to an output voltage of 6.8V.
I would like to answer the following questions
1.How do you think it is generated? If you have any materials, I would be happy if you could tell me.
2. I am currently considering TPS55340 as a replacement product.
Can this device generate an output voltage of -6.8V from an input voltage of -15V?
(If it can be generated, please tell me the output current range at that time.)
Also, if you know other devices that can be created, please let me know.
Best Regards,
Y.Ottey
Part Number: TPS709
HI,
I' posting this question on behalf of my customer.
We have a TPS70933DRVR supplying the 3.3V rail. We need to manually short circuit the output briefly (0.1s) via a relay on our automated test and assembly line in order to reset the PCB. Is there danger to shorting the output like this? This IC has short circuit protection via thermal limiting but TI has expressed concerns about doing this in the past when we asked. https://e2e.ti.com/support/power-management/f/196/t/610120 The difference is that that IC did not have thermal shutdown and the one we are using now does.
The TPS70933DRVR input should be on battery power in the range 7.6 – 7.9 volts. We also do not have the option to use the EN pin as we are already in MP on the PCB.
Thanks!
Lauren
Part Number: TPS61372
In an application boosting ~5V -> 6V @ 200mA we have the following external components:
L = 10uH
Cout - 3* 10uF ceramic
Rup = 1Meg
Rdown = 100k
Comp -> 5.49K in series with 27nF
Is it valid to add 1000pF across Rup in the feedback loop so that the output rise time is not so fast? What is the impact on phase margin due to this addition?
Part Number: TPS548D22
Hi team,
My customer is using the TPS548D22 now and set the frequency to 650khz, but the real frequency is 545khz~590khz which is beyond datasheet value 585khz~740khz. Do you have some ideas about the phenomenon? Thanks.
Part Number: LP8860-Q1
Since the NSS pin is active low in the SPI interface, can it be connected to ground so it stay active?
Part Number: LM3478
Hi,
We are using LM3478 in one of our project with below configurations:
Vin: 3.0V to 4.1V
Vout: 4.2V
Iout: 8A
Below is the schematic that is designed based on the suggestions provided on webench:
Same has been taken from the webench design tool.
Few observations as below:
1. As soon as output current crosses 3.5A input capacitor C161 starts heating (>50-60 C)
2. If raising load current >4A IC stops the switching and we receives VIN-0.3V in output.
3. Tried changing resistor value for R163 and change the operating frequency but no any change observed in results.
Thanks,
Dhvanish Parekh
Part Number: LMZM23601
Violating the storage temperature abs max (150C) would lead to potentially long-term performance degradation, correct?
What about on the cold end of the spectrum? Would storage at -55C, which is beyond the abs min of -40C, cause any long-term performance degradation?
Thanks.
Part Number: BQ34Z100-G1
Part Number: TPS2481
Do you know where to find reliability data for TPS2481? TI online MTBF estimator can't find this part.
Part Number: TPS50601A-SP
Team,
Can we state what the min Vout of TPS50601A-SP is? (Vref 0.804V)
Part Number: TPS7A39
Hello team,
Customer is using TPS7A39 with (-/+16V --> -/+15V) for a low noise application. Now we need to support higher current of 400~500mA. I'm not aware of any part similar to TPS7A39 with 500mA output current.
Can we parallel two TPS7A30 and TPS7A49 for this purpose? I see we have TPS7A47 (for positive) and TPS7A33 (for negative) that go up to 1A and wide VIn with low noise, would we have any other recommendation? LP38798 could be a lower current option as well, but not sure about the negative rail implementation on this part. Look forward to your suggestions. Thanks!
Part Number: TLV760
I know many three-terminal regulators are subject to problems/failure if the input supply is shut off and the output side is still powered (either from an alternate source, or by large output capacitors).
Usually the cure is a diode from the output back to the input, anode to the output, cathode to the input of the regulator.
Is this necessary with the TLV760 family (5V or 3.3 variant)?
In my case, the output cap is 1uF, and the load is a very-low-power processor.
I may want to apply external power to the processor (ie, to the TLV760 voltage regulator output) without input power to the TLV760 for in-circuit programming of the processor chip, although if need be I could have test fixturing provide input power to the TLV760 in this situation.
I have very little space on board, so if I can get by without the extra diode, I'd be a happy camper.
Part Number: LM74700-Q1
I'd like to evaluate this product in LTSPice, but the spice model is encrypted.
Please supply an un-encrypted version - thanks.
Part Number: LM5069
Hi Team,
I need some help on my circuit design using LM5069.
I am designing a circuit with minimum input voltage 9.3 V. In datasheet it is mentioned that minimum input voltage for this component is 9 V. So it should be OK.But in LM5069 Design Calculator (Rev. C) it does not let me to enter any input voltage less than 10V in"Step5" in "Desired Upper UVLO Threshold" cell. comment on that cell says : "This threshold must be between 10V and 80V." and eror pops up when I try to calculate R1,R2 and R3 resistors.
Does it mean that this device is not appropriate for voltages below 10V ( similar to my design)?
Or i should disregard LM5069 Design Calculator (Rev. C) and rely on the numbers in datasheet and calculate my UVLO and OVP resistors manually?
Thanks,
Part Number: TPS54340B
Howdy, my last question on this topic was redirected here. I need help with designing passives (compensation etc) to support a nominal switching frequency on the TPS54340 at 2+mhz, 2.2 mhz would be ideal, for an automotive application.
When I use the "TPS54360-361FAMILY_CALC_TOOL_REVE.xls" the frequency field turns Red, so I'm not sure if that means the value for the cell is "out of bounds" for the calculator.
Thank you so much!
Part Number: TPS22913
Hi Sir,
Our customer used the TPS22913B & TPS22913C on product, But have some question need to clarify.
Could you please support this case for me?
1. Were TPS22913B&C be passed ESD test by JESD22-A115-A? how many sample size?
2. Were TPS22913B&C be passed Gate Leakage Test?
3. Could you provide internal Visual inspection (,SEM cross section) after Temp cycling, Autoclave, and Biased Humidity test?
4. Were TPS22913B&C be passed High Temperature Operating Life test by JESD22A-108B? how many sample size?
5. Were TPS22913B&C be passed Preconditioning test by JESD-22- A113B? how many sample size?
6. Do the IC package used the plastic? If yes, please provide C-SAM test result .(used to detect the risk of IC cracking)?
7. What's the material type for IC Package substrate?
(1) ENIG ,
(2) Electrolytic Ni-Au,
(3) Solder on Pad (SOP),
(4) other?
8. Does the IC have problems with Dendrite growth and Corrosion?
If yes, will it affect functionality and reliability? Please provide a verification report and explan which function will be affected.
If not, please submit a verification report to prove that it is ok.If the PCB is used inside the IC, what is the PCB material? Does it use the ENIG?
9. Supplier has the documents to show known failure modes of the IC technology used and can provide references or documents.
10. Could you provide Package assembler & Location?
11. Could you provide Substrate Technology (including dielectric material, line/space, core via pitch, substrate layer stack-up & thickness, number of stack vias)?
12. Could you provide Substrate surface finish for the solder ball ( E.g.. SOP, E'lytic Ni/Au; E'less Ni/Au)?
13. Could you provide Substrate layer count (Signal/Power/Ground) total. For build up substrate, number of build up layers?
14. Could you provide Mold Compound Alpha emission rate (alpha/cm2/hr) - for wire bond package?
15. Could you provide Bump/Underfill/SOP Alpha emission rate (alpha/cm2/hr) - for flip chip package?
16. Any passive component (e.g. by-pass capacitors) in the package (Y/N)? If "Yes",provide the value, form factor and the way they are assembled to the package substrate
17. Could you provide Maximum number of power on hours (hrs)?
18. Could you provide Max number of power on/off cycles (cycles)?
19. Could you provide Verification data for the design / process / material not prone to dendrite growth or corrosion for IC package at IC packaging CM
(1) Confirm for compliance to item (Y /N)
(2) Provide Documentation(as needed)
(3) Frequency of failure (Provide history for last 12 months)
(4) Corrective Action Implemented & date
(5) Communicate Results (Impact - Reliability)
Part Number: LM53635-Q1
Hi Sir,
in some TI chip, we have a Pin to Pin short test(typically two close pin) to make sure that out chip will not damage and will be back to normal if the short condition removed.
Do we have such report or test result on LM53635-Q1?
Many thanks,
Patrick